|
|
|
|
COPPER FLEX CIRCUITS
Dawar Technologies offers comprehensive capabilities in fulfilling your Copper Flex Circuitry requirements. With multiple base materials, coatings, shielding, layers and terminations, we can provide the custom solution you need.
| A solution to a packaging problem. | - • Flexible circuits allow unique designs that solve interconnection problems.
- • The formability of flex circuits enables a package size reduction.
- • Flex circuits make installation and repair practical and cost effective.
|
| Reduced assembly costs. | - • Flex circuit can be tested prior to assembly of components.
- • Elimination of connectors and solder joints reduce costs.
|
| Replacement for a circuit board and wires. | - • Flexible circuits simplify system design.
- • Flex reduces the number of levels of interconnection required in an electronic package.
- • Flexible circuits eliminate human error common in wire assemblies.
|
| Reduced weight and space. | - • Considerable weight reduction is a benefit over wire harnesses.
- • Thickness can be as thin as 0.004 inches (0.10mm) in total.
|
| Dynamic flexing. | - • The thinness of the material makes flexible circuits the best candidate for flexible applications up to millions of flexures.
|
| Thermal Management/ High Temperature applications. | - • Flex circuits dissipate heat at a better rate than any other dielectric materials while providing the added benefits of vastly improved flexibility.
|
| Aesthetics. | - • Flex circuits improve the internal appearance of an electronic package.
|
| Base Materials |
| Polyimide (Kapton) | 0.5 mil to 5 mils (0.012mm to 0.127mm) |
| Polyester (Dupont Mylar) | 1 mil to 15 mils (0.025mm to 0.381mm) |
| PEN (Kaladex/Kalidar) | Polyethylene naphthalate |
| ULTEM (GE) | 3 mils to 7 mils |
| DUROID | |
| LCP | |
| Base Copper |
| 0.5 oz. - 0.0007" (0.018mm) |
| 1 oz. - 0.0014" (0.036mm) |
| 2 oz. - 0.0028" (0.071mm) |
| 3 oz. - 0.0042" (0.107mm) |
| 4 oz. - 0.0056" (0.142mm) |
| 5 oz. - 0.0070" (0.178mm) |
| 6 oz. - 0.0084" (0.213mm) |
| 7 oz. - 0.0098" (0.249mm) |
| Solder Mask |
| Polyimide coverlay | 0.5 mil to 5 mils (0.012mm to 0.127mm) |
| Polyester coverlay | 1.5 mil to 3 mils (0.076mm to 0.228mm) |
| Photo-imageable covercoat | Dry film and liquid for surface mount and dense applications |
| Surface Finishes |
| Hot air level (HAL) | |
| Tin plating | Electroless and electrolytic |
| Silver | Electroless |
| Hard gold over nickel | Typically used for contacts |
| Soft gold over nickel | Electroless typically used for bonding aluminum wire to the nickel under the gold |
| Soft gold over nickel | Electrolytic typically used for bonding gold wire to the gold layer |
| Organic Coating | |
|
QuickQuote
Need a price? Get it quickly with our online quote system.
SampleRequest
Want to see the real thing? We’ll get it to you.
InfoRequest
Don’t see what you’re looking for or have questions? Tell us what you need.
|
SINGLE-SIDED CIRCUITS
Single-sided flexible circuits consist of a single copper conductor layer on a flexible dielectric film. Single-sided circuits can be fabricated with or without coverlayers.
| Very thin construction under 0.004" to 0.008" (0.10mm to 0.20mm) |
| One conductive layer |
| Reverse bared or back bared pads |
| Supported and unsupported finger areas |
When to use
- • Dynamic flexing applications
- • Unusual folding and forming applications
- • Installation/service applications/repair
- • Limitations on space/thickness
- • Installation/service flexing
|
|
DOUBLE-SIDED CIRCUITS
Double-sided flexible circuits consist of two copper layers encapsulated with a dielectric, normally connected with a plated through hole. Double-sided circuits can be fabricated with or without coverlayers.
| Component assembly available on both sides |
| Two conductive layers for trace routing |
| Fingers are an integral part of the conductor patternss |
When to use
- • Required when circuit density and layout cannot be routed on a single layer
- • Ground and power plane applications
- • Shielding applications
- • Dense surface mount assembly
|
|
MULTI-LAYER CIRCUITS
Multi-layer flexible circuits consist of more than two copper layers encapsulated with a dielectric, connected with a plated through hole. Controlled impedance and shielding is possible with this style circuit.
| Component assembly available on both sides |
| Two conductive layers for trace routing |
| Fingers are an integral part of the conductor patternss |
When to use
- • Required when circuit density and layout cannot be routed on a single layer
- • Ground and power plane applications
- • Shielding applications
- • Dense surface mount assembly
Solid copper
Solid copper is the most common method of shielding. Solid copper shields increase the rigidity of the circuit, and should be included in thickness to bend radius review. Copper shield can be put on one or both sides of the circuit. Solid copper can also cover selective conductors.
Crosshatched copper
Crosshatching is an artwork design that relieves much of the copper shield areas by the use of a pattern. Crosshatching helps the circuit to retain its flexibility and can be put on one or both sides. Crosshatch shielding can also cover selective conductors.
Conductive silver
Conductive silver can be substituted for the copper for shielding purposes in some applications. Silver shielding is not recommended for a dynamic flexing application due to its brittle characteristic, and may be prone to cracking in severe bending applications. Silver can be a solid or crosshatched shield and can be put on one or both sides of the circuit. It can also cover selected conductors only.
|
|
RIGIDIZERS/STIFFENERS
FR4/G10 Stiffeners
- • Come in a variety of thicCome in a variknesses such as 0.010" (0.25mm), 0.020" (0.50mm), 0.031" (0.78mm), 0.047" (1.19mm) and 0.062" (1.57mm).
- • Can be bonded to a flex circuit using a pressure-sensitive adhesive or a thermal-set adhesive.
- • Are normally used to give added rigidity under a connector area.
- • Used as a carrier panel for automated assembly processing.
- • Hole size in the stiffener should be 0.015" (0.38mm) larger than the circuit thru-hole to allow for registration tolerances.
Polyimide or Polyester Stiffeners
- • Come in a variety of thicknesses from 0.001" (0.02mm) up to .015" (0.38mm) or higher.
- • Can be bonded to a flex circuit using a pressure sensitive adhesive or a thermal set adhesive.
- • Can be used to give added thickness under conductor fingers to meet ZIF connector requirements.
- • Can be used to give added strength in high wear areas.
- • Can be blanked at the same time as the circuit outline to meet tight tolerance requirements.
| ZIF connectors | Zero Insertion Force connectors are becoming an increasingly popular method to terminate a flexible circuit. Use of a ZIF connector eliminates the need for a mating connector. The flex end “mates” into the connector usually located on the rigid board and can come equipped with a latching feature. |
| Thru-hole or surface mount connectors | These are the traditionally used connectors in today’s circuit boards. |
| Crimped contacts and displacement connectors | - • Contacts crimp through the dielectric material into the copper conductor.
- • Contacts are available for 0.100" (2.54mm) or 0.050" (1.27mm).
- • Centerline housings are also available to encapsulate the contact.
|
|
|
|
|
 |
|
|
|
|
Dawar Technologies
1016 North Lincoln Ave
Pittsburgh, PA 15233-2302
1-800-366-1904
|
